Epoxy acrylates

C - Chemistry – Metallurgy – 07 – D

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Details

C07D 303/18 (2006.01) C08G 59/06 (2006.01) C08G 59/17 (2006.01)

Patent

CA 2127232

Novel epoxy acrylates and carboxyl group- containing epoxy acrylates of formulae II SEE FORMULA I wherein M is the group of formula SEE FORMULA II R1 is -H or -CH3, R2-H, -CH3 or phenyl, R is -H, C1-C4 alkyl or halogen, x is an integer from 0 to 3, and Y is a linking group of formula SEE FORMULA III wherein R3 and R4 are each independently of the other hydrogen or C1-C4alkyl, or R3 and R4, together with the linking carbon atom, form a 5- or 6-membered hydrocarbon ring, and the aromatic radicals of the linking group Y are unsubstituted or substituted by halogen or C1-C4alkyl, X is -S-, -O-, or -SO2-, and n is an integer from 0 to 300, with the proviso that at least 10 mol % of the radicals M have the structure of formula Image in which R1 and R2 are as defined above and III Image wherein A is hydrogen or the group of formula Image and R1, R2, R, n and x are as defined above, R5 is the radical of a cyclic anhydride of a polycarboxylic acid after removal of the anhydride radical, and at least 10 mol% of the radicals A have the structure of the formula Image and Y is a linking group of the formula Image or wherein R3 and R4 are independently of one another hydrogen or C1-C4alkyl or R3 and R4, together with the linking carbon atom, form a 5- or 6-membered hydrocarbon ring, and the aromatic radicals of the linking group Y are unsubstituted or substituted by halogen or C1-C4-alkyl, and X is -S-, -O- or -SO2- of the claims that are relatively high molecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

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