C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/5423, 400/55
C09J 163/10 (2006.01) C08G 59/40 (2006.01) C08G 59/50 (2006.01) C08G 59/56 (2006.01)
Patent
CA 1323120
EPOXY ADHESIVE (D#80,667-F) ABSTRACT OF THE DISCLOSURE The invention is an epoxy resin adhesive composition. The composition comprises: A. An epoxy resin component comprising: 1. 72 to 104 pbw of a vicinal polyepoxide having an average of at least 1.8 reactive 1,2-epoxy groups per molecule, 2. 8 to 16 pbw of trimethylolpropanetriacrylate 3. 10 pbw of a polyoxypropylene diureide of 2000 to 3000 molecular weight; and B. A curative component comprising: 1. a curing amount of triethyleneglycol diamine or tetraethyleneglycol diamine; and 2. an effective cure acclerating amount of piperazine, N-aminoethylpiperazine or mixture thereof. The fast curing adhesive offers high lap shear strength and relatively high peel strength.
567065
Sellstrom Kathy B.
Waddill Harold G.
Sellstrom Kathy B.
Smart & Biggar
Texaco Development Corporation
Waddill Harold G.
LandOfFree
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