Epoxy adhesive film for electronic applications

Details Epoxy adhesive film for electronic applications Epoxy adhesive film for electronic applications

C - Chemistry, Metallurgy

09

J

400/4703

C09J 171/00 (2006.01) C08G 59/50 (2006.01) C08L 63/00 (2006.01) C08L 71/00 (2006.01) C09J 7/00 (2006.01) C09J 163/00 (2006.01) H01L 21/58 (2006.01)

Patent

CA 1298008

60557-3373 Abstract An adhesive composition which is particularly suitable for use as a die-attach adhesive The adhesive composition comprises the reaction product of an admixture of an effective amount of a phenoxy resin, at least one epoxy resin and a fluorene curative, wherein said phenoxy resin is represented by the formula: Image said fluorene curative is represented by the formula Image and said at least one epoxy resin is Image or 60557-3373 Image

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