Epoxy adhesives with dithiooxamide adhesion promoters

Details Epoxy adhesives with dithiooxamide adhesion promoters Epoxy adhesives with dithiooxamide adhesion promoters

C - Chemistry, Metallurgy

09

J

C09J 163/00 (2006.01) C09J 11/06 (2006.01)

Patent

CA 2216420

The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of formula (I) in which R1 and R2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.

Composition adhésive époxy de construction thermodurcissable, renfermant: (a) une résine époxy; (b) un agent de durcissement pour la résine époxy; et (c) un composé de la formule (I) dans laquelle R?1¿ et R?2¿, qui peuvent être identiques ou différents, sont choisis dans le groupe alkyle, hydroxyalkyle, cycloalkyle, aryle, arylalkyle, ou bien dans un groupe hétérocyclique dans lequel lesatomes un à trois qui ne sont pas des atomes de carbone dans la liaison sont choisis indépendamment entre S, N et O.

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