C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 163/00 (2006.01) C08G 59/04 (2006.01) C08G 59/06 (2006.01) C08G 59/14 (2006.01) C09D 4/00 (2006.01) C09D 7/02 (2006.01) C09D 7/12 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2186424
Aqueous, low-solvent coating compositions comprising a base resin dispersion comprising of an epoxy resin, prepared by condensation of one or more epoxide compounds having at least two epoxide groups per molecule and an aromatic polyol; a dispersant comprising a condensation product of an aliphatic polyol having a weight-average molar mass (Mw) of from 200 to 20,000 g/mol and an epoxide compound having at least two epoxide groups per molecule, and low molar mass, liquid, epoxy- functional compounds as diluents, and also water; an aqueous curing agent for the modified epoxy resin (I), which is suitable for curing at room temperature or at elevated temperatures (forced drying), components (I) and (II) being employed in mass fractions such that the ratio of the number of reactive epoxide groups in (I) to the number of amine hydrogen atoms in (II) is between 1:0.75 and 1:2. The coating compositions exhibit an extended pot life. They can be used to produce coatings and in water- soluble adhesives.
Godau Claus
Pfeil Armin
Stengel-Rutkowski Bernhard
Fetherstonhaugh & Co.
Vianova Resins Gmbh
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