C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/250, 402/44,
C08G 59/56 (2006.01) C08G 59/50 (2006.01) C08G 59/68 (2006.01) C08J 5/24 (2006.01)
Patent
CA 1246293
- 48 - ABSTRACT OF THE DISCLOSURE Curable thermosetting resin compositions comprising an epoxy resin having at least two 1,2-epoxy groups per molecule, an aromatic diamine hardener, and as a cure accelerator an aromatic trihydroxy compound are disclosed. The aromatic trihydroxy compound, such as for example, phloroglucinol, n-propyl gallate, or pyrogallol, improves the cure speed of the epoxy/aromatic diamine resin system, while at the same time producing cured compositions having excellent mechanical and thermal properties. The disclosed compositions find particular application in the preparation of composites by, e.g., filament winding procedures.
506875
Gardner Hugh C.
Qureshi Shahid P.
Bp Corporation North America Inc.
Sim & Mcburney
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