Epoxy based synthetic solder

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

400/1313, 400/13

C08K 5/21 (2006.01) C08G 59/40 (2006.01) C08L 63/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1157187

ABSTRACT OF THE DISCLOSURE Epoxy based synthetic solders are prepared from (a) at least one epoxy resin, (b) at least one filler, (c) 1,1'-o-phenylenebis- (3,3-dimethylurea) wherein the phenyl moiety is optionally substituted with up to two alkyl (C1-3) groups and (d) dicyandiamide.

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