Epoxy bond diamond saw

Details Epoxy bond diamond saw Epoxy bond diamond saw

B - Operations, Transporting

28

D

143/75

B28D 1/12 (2006.01) B28D 1/08 (2006.01)

Patent

CA 1072862

Abstract of the Disclosure A cutting tool is disclosed comprising a plurality of blocks of composite, comminuted abrasive in a metal matrix, resiliently mounted to a metallic substrate by an elastically pliant epoxy based adhesive. In a preferred embodiment of the invention a relatively thin layer or film comprising a flexible metal such as copper, metallurgically bonded to the metal matrix, is sandwiched between the blocks and the epoxy adhesive, and con- tributes to the resiliency of the mounting, and promotes bonding to the epoxy.

275797

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