Epoxy composition and sealing of integrated circuit modules...

Details Epoxy composition and sealing of integrated circuit modules... Epoxy composition and sealing of integrated circuit modules...

C - Chemistry, Metallurgy

08

L

400/4028, 400/50

C08L 63/00 (2006.01) C08G 59/42 (2006.01) C08G 67/04 (2006.01) C09J 163/00 (2006.01) H01B 3/40 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1180485

ABSTRACT A composition containing an epoxy polymer, 4,4'(2- acetoxy-1,3 glyceryl)bis anhydro trimellitate; a poly- anhydride; and a solid filler; method of preparation, and the sealing of integrated circuit modules therewith are provided.

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