C - Chemistry – Metallurgy – 07 – D
Patent
C - Chemistry, Metallurgy
07
D
402/292, 260/370
C07D 303/30 (2006.01) C07D 303/24 (2006.01) C07D 303/28 (2006.01) C08G 59/06 (2006.01) C08G 59/24 (2006.01)
Patent
CA 1331904
ABSTRACT OF THE DISCLOSURE Disclosed is a novel epoxy compound of the chemical structure: Image (A) (wherein n is the number of recurring units and has a value in the range of from 0 to 30, R1 and R2 are independently selected from the group consisting of hydrogen and alkyl radicals having 1 to 6 carbon atoms, R3 is an alkyl radical having 1 to 6 carbon atoms, and R4 is a tertiary alkyl radical). Also disclosed is an epoxy resin composition comprising the epoxy compound, a curing agent and a curing accelerator. The composition cures into a product having a low dielectric constant and may be used for example as an electrical insulating material, an adhesive or a coating composition.
568035
Nakamura Hideo
Takata Toshimasa
Mitsui Chemicals Incorporated
Smart & Biggar
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