C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 214/22 (2006.01) H01M 4/62 (2006.01) H01M 4/52 (2006.01) H01M 6/10 (2006.01)
Patent
CA 2176424
A vinylidene fluoride copolymer having a relatively high molecular weight is formed by copolymerizing (a) vinylidene fluoride as a principal component, (b) a small amount of epoxy group- containing monomer, and (c) an optional component, such as an unsaturated dibasic acid monoester functioning as a curing agent for the epoxy group. When cured with an optional epoxy curing agent, the vinylidene fluoride copolymer provides a cured product having an adhesion with a metal substrate, etc., and also showing excellent solvent resistance and chemical resistance. The vinylidene fluoride copolymer is particularly suitable for constituting a binder for producing an electrode for non-aqueous solvent-type secondary battery.
Horie Katsuo
Kashio Hidetora
Suzuki Fujio
Fetherstonhaugh & Co.
Kureha Kagaku Kogyo Kabushiki Kaisha
LandOfFree
Epoxy group-containing vinylidene fluoride copolymer and its... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Epoxy group-containing vinylidene fluoride copolymer and its..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy group-containing vinylidene fluoride copolymer and its... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1527216