C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/270, 400/793
C08G 59/40 (2006.01) C07D 498/20 (2006.01) C08G 59/44 (2006.01) C08G 59/50 (2006.01)
Patent
CA 1319781
Abstract of the Disclosure This invention relates to the use of compositions of the formula: Image wherein n is 2 to 4 and X is -O-, -S- or Image wherein R1 is an aliphatic or aromatic moiety as a curing agent for epoxy resins to form a thermoset material which has a reduced shrinkage.
542659
Gowling Lafleur Henderson Llp
Grace (w.r.) & Co.
Lin Shiow C.
W.r. Grace & Co.,-Conn.
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