C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/253, 400/546
C08G 59/00 (2006.01) C08F 283/10 (2006.01) C08G 59/14 (2006.01) C08G 59/36 (2006.01)
Patent
CA 1224597
ABSTRACT OF THE DISCLOSURE An epoxy impregnating resin composition comprising 100 parts by weight of a compound having at least two epoxy groups in one molecule, from 0.1 to 100 parts by weight of an allyl epoxy compound having both allyl and epoxy groups in one molecule and represented by the general formula: Image where R is hydrogen, halogen or a monovalent organic group, from 30 to 300 parts by weight of a liquid cyclic acid anhydride, from 0.1 to 10 parts by weight of a phenoxy resin having a molecular weight of form 10,000 to 50,000; and from 5 to 300 parts by weight of a compound having a polymerizable double bond.
455864
Jidai Eiki
Miyamoto Fumiyuki
Murayama Masakazu
Nakajima Hiroyuki
Marks & Clerk
Mitsubishi Denki Kabushiki Kaisha
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