Epoxy modified structural adhesives having improved heat...

Details Epoxy modified structural adhesives having improved heat... Epoxy modified structural adhesives having improved heat...

C - Chemistry, Metallurgy

08

K

400/4008

C08K 5/52 (2006.01) C08F 291/00 (2006.01) C08L 63/00 (2006.01) C08L 101/00 (2006.01) C09J 4/00 (2006.01) C09J 4/06 (2006.01)

Patent

CA 1214585

ABSTRACT OF THE DISCLOSURE Structural adhesive systems having improved heat resistance comprising a solution or dispersion of a polymeric material in a mono- mer copolymerizable therewith, an unsaturated organophosphorus partial ester and an epoxy resin are disclosed.

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