C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/4008
C08K 5/52 (2006.01) C08F 291/00 (2006.01) C08L 63/00 (2006.01) C08L 101/00 (2006.01) C09J 4/00 (2006.01) C09J 4/06 (2006.01)
Patent
CA 1214585
ABSTRACT OF THE DISCLOSURE Structural adhesive systems having improved heat resistance comprising a solution or dispersion of a polymeric material in a mono- mer copolymerizable therewith, an unsaturated organophosphorus partial ester and an epoxy resin are disclosed.
436513
Lord Corporation
Marks & Clerk
LandOfFree
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