Epoxy/polyester hot melt compositions

Details Epoxy/polyester hot melt compositions Epoxy/polyester hot melt compositions

C - Chemistry, Metallurgy

09

J

C09J 163/00 (2006.01) B32B 7/12 (2006.01) B32B 27/04 (2006.01) B60J 10/00 (2006.01) B60R 13/04 (2006.01) C08G 59/68 (2006.01) C09J 5/00 (2006.01) C09J 7/00 (2006.01) C09J 167/02 (2006.01) H05K 3/38 (2006.01) B32B 31/28 (1990.01)

Patent

CA 2115888

ABSTRACT OF THE DISCLOSURE EPOXY/POLYESTER HOT MELT COMPOSITIONS Hot melt compositions comprise from 2 to 95 parts of an epoxy-containing material, correspondingly, from about 98 to 5 parts of a polyester component, an effective amount of a photoinitiator for radiation curing the hot melt composition, and an optional hydroxyl-containing material. The hot melt composition is a solid at room temperature but can be melted to a liquid upon heating. The invention also relate to a method of adhesively bonding two substrates together using the hot melt compositions.

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