Epoxy resin blend for resin transfer molding and filament...

Details Epoxy resin blend for resin transfer molding and filament... Epoxy resin blend for resin transfer molding and filament...

C - Chemistry, Metallurgy

08

L

C08L 63/02 (2006.01) C08G 59/22 (2006.01) C08G 59/38 (2006.01) C08G 59/50 (2006.01) C08L 63/00 (2006.01) C08L 63/10 (2006.01)

Patent

CA 2053439

A resin composition especially suited to the resin transfer molding and wet filament winding processes is composed of epoxide compounds and one or more aromatic amine hardeners wherein the blend of epoxide compounds is (i) a diglycidyl ether of the reaction product of a bisphenol and a halohydrin having about two epoxy groups per molecule, (ii) a blend of (a) a diglycidyl ether of bisphenol A other than that of (i) and (b) a copolymer of ethyl hexyl acrylate and glycidyl methacrylate and (iii) a neopentyl glycol digylcidyl ether. This composition has a low viscosity, and when cured, high toughness and mechanical strengths useful in making high performance composites.

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