Epoxy resin blends and curable compositions containing same

Details Epoxy resin blends and curable compositions containing same Epoxy resin blends and curable compositions containing same

C - Chemistry, Metallurgy

08

L

117/198, 400/421

C08L 63/00 (2006.01) C08L 21/00 (2006.01) C08L 57/00 (2006.01) H01L 21/56 (2006.01) H05K 5/02 (2006.01)

Patent

CA 2027924

ABSTRACT Blends comprising (A) at least one unsaturated hydrocarbon-phenol epoxy resin having an average of more than two vicinal epoxy groups per molecule; (B) at least one compound having an average of more than two vicinal epoxy groups per molecule and which is different from component (A); (C) optionally, at least one compound having an average of more than one, but not more than two vicinal epoxy groups per molecule and, (D) at least one rubber or elastomer; and wherein component (C) is present in an amount such that from zero to less than 20 percent of the total amount of vicinal epoxy groups contained in components (A), (B) and (C) is contributed by component (C) are useful in formulations for encapsulating electrical components. 37,657-F

Affiliated with

Also associated with

Rating

Epoxy resin blends and curable compositions containing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin blends and curable compositions containing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin blends and curable compositions containing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1745613