Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

C - Chemistry, Metallurgy

08

G

402/252

C08G 59/30 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1042593

ABSTRACT OF THE DISCLOSURE This application discloses an epoxy resin composition containing, as a reactive diluent, 2-chloro- -1-chloromethylethyl-2,3-epoxy propyl ether. The cured resins have good physical properties and are useful as grouting and flooring compositions and in coating systems and adhesives.

235825

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