Epoxy resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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C08L 79/08 (2006.01) B32B 17/04 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1200045

ABSTRACT OF THE DISCLOSURE EPOXY RESIN COMPOSITIONS A hardenable epoxy resin composition comprising a curable epoxy resin, a hardener for the epoxy resin and a polyetherimide having the general formula; Image where X is CyH2y, or Image , or -S- y is a positive integer from 1 to 5 m is 0 or 1 n is a positive integer from 20 to 150 and R1 is an aromatic hydrocarbon radical having from 6 to 20 carbon atoms, or a cycloalkylene radical having from 2 to 20 carbon atoms or a divalent radical of the formula Image where Q is -O-, Image , Image , -S- or CxH2x and x is a positive integer from 1 to 5. Preferably X is C3H6 and R1 is preferably Image The compositions are particularly suitable for use in fibre composite materials.

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