Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

C - Chemistry, Metallurgy

08

L

117/198, 400/421

C08L 61/14 (2006.01) C08L 63/04 (2006.01) C09D 5/03 (2006.01) C09D 161/14 (2006.01) C09D 163/04 (2006.01)

Patent

CA 2021190

EPOXY RESIN COMPOSITION Abstract of the Disclosure An epoxy resin composition suitable for encapsulating electric parts is disclosed which includes a mixed epoxy resin composed of a bisphenol epoxy resin and a novolac epoxy resin, and a curing agent selected from the group consisting of (a) aliphatic dicarboxylic acids of the formula: HO - CO - R - CO - OH wherein R represents a divalent, aliphatic hydrocarbyl group containing a divalent, linear skeletal structure having at least 8 carbon atoms, (b) diphenylol derivatives of the formula: HO-C6H4-C(CH3)2-C6H4(O-CH(OH)-CH2-O-C6H4-C(CH3)2-C6H4)mOH wherein m is an integer of 0-8, and (c) mixtures thereof.

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