Epoxy resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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402/1, 402/250,

C08L 63/00 (2006.01) C08F 12/04 (2006.01) C08F 32/08 (2006.01) C08F 240/00 (2006.01) C08K 5/04 (2006.01) C08L 57/00 (2006.01)

Patent

CA 1104293

ABSTRACT OF THE DISCLOSURE An epoxy resin composition comprising (A) a novel copolymer produced by polymerizing a polymerizable material selected from the group consisting of (a) substituted or unsubstituted dicyclopentadiene; (b) a cationically polymeriz? e unsaturated hydro- carbon-containing fraction obtained by distilling a cracking or reforming product of a petroleum and having a boiling point in the range of -20°C. to 280°C. (c) a cationically polymerizable vinyl aromatic hydrocarbon having 8 to 10 carbon atoms; (a) a mixture of two or three of ingredients (a), (b) and (c); and (e) a mixture of any ore of ingredients (a) to (d) with a cationically polymerizable unsaturated aliphatic hydrocarbon having 4 to 10 carbon atoms in the presence of a cationic polymerization catalyst with a high-boiling product having a boiling point of at least about 150°C. and an oxygen content or at least 0.5% by weight being introduced into the polymerization system at any stage of the polymerization process or into the result- ing polymer, the said high-boiling product being obtained as a by-product in a process comprising oxidizing a benzene or naphthalene ring-substituted with at least one isopropyl group to convert it to the corresponding hydroperoxide and then decomposing it with an acid to produce the correspond- ing phenols or naphthols; (B) a polyepoxy compound; and (C) a curing agent. This epoxy resin composition is useful for paints, adhesives, road-repairing materials, floor coverings, etc.

301905

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