C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/7918
C08L 63/00 (2006.01) C08G 59/62 (2006.01) C08K 5/544 (2006.01) C08K 5/549 (2006.01) C09D 5/34 (2006.01) C09D 163/00 (2006.01)
Patent
CA 2025707
EPOXY RESIN COMPOSITION ABSTRACT A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.
Enami Hiroji
Imai Takeshi
Dow Corning Toray Silicone Company Ltd.
Gowling Lafleur Henderson Llp
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