Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

C - Chemistry, Metallurgy

08

L

400/7921

C08L 63/00 (2006.01) C08K 3/36 (2006.01) C09J 163/00 (2006.01) H05K 3/30 (2006.01)

Patent

CA 2040628

EPOXY RESIN COMPOSITION Abstract A liquid epoxy resin composition including an epoxy resin, an amine curing agent and hydrophilic silica and exhibiting good shape retention at a curing temperature. The composition is stable and does not undergo changes in viscosity even stored at 40 °C for 20 days. The composition may be obtained by blending a mixture containing an epoxy resin and hydrophilic silica having a thixotropy index of at least 4 with an amine curing agent to obtain a blend, and commingling the blend until the thixotropy index thereof is decreased to 2 or less.

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