Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

C - Chemistry, Metallurgy

08

G

C08G 8/08 (2006.01) C08G 59/02 (2006.01) C08G 59/08 (2006.01) C08L 61/10 (2006.01) C08L 63/04 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2121876

ABSTRACT OF THE DISCLOSURE An epoxy resin composition which exhibits a low dielectric constant and a low dielectric dissipation factor as well as an excellent working susceptibility after its curing is provided. The epoxy resin composition contains at least one member selected from a novolak resin (A) prepared by condensing formalin and an alkylphenol compound; and an epoxy resin (B) prepared by glycidylating said novolak resin (A) with an epihalohydrin.

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