Epoxy resin composition

Details Epoxy resin composition Epoxy resin composition

C - Chemistry, Metallurgy

08

G

402/261, 402/43,

C08G 59/18 (2006.01) C08G 14/00 (2006.01) C08G 59/40 (2006.01) C08G 59/68 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1134990

ABSTRACT OF THE DISCLOSURE An epoxy resin composition comprising (A) a polymer having a hydroxyl content of 0.3 to 7 millimoles/g, said polymer being prepared by polyme- rizing a polymerizable material selected from the group consisting of (a) cationically polymerizable hydrocarbon- containing fractions having a boiling point in the range of from 140 to 280°C obtained by distillation of a crack- ing or reforming product of a petroleum, (b) a cationically polymerizable aromatic unsaturated hydrocarbon, and (c) a mixture of (a) and (b), in the presence of a cationic poly- merization catalyst andmodifying the resulting polymer with a phenol or naphthol; (B) a polyepoxy compound; and (C) a curing agent. The epoxy resin composition thus obtained is especially useful in the field of paints.

303330

Affiliated with

Also associated with

Rating

Epoxy resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-693806