C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/20 (2006.01) B32B 15/08 (2006.01) B32B 15/14 (2006.01) C08G 59/06 (2006.01) C08G 59/08 (2006.01) C08G 59/38 (2006.01) C08L 63/00 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2106709
ABSTRACT EPOXY RESIN COMPOSITION AND COPPER-CLAD LAMINATE An epoxy resin composition excellent in heat resistance and low in dielectric and a copper-clad laminate obtained by molding it are disclosed. The epoxy resin composition of the invention comprises: (1) a compound obtained by previously reacting (A) an epoxy resin obtained by glycidyl etherifying a 3-methyl-6-(C4-C8)alkylphenol novolak with (B) a halogen-containing bisphenol compound represented by the following formula (1): (1) Image wherein R1 represents a hydrogen atom or a methyl group and the two R1 may be identical or different, X and X1 represent halogen atom and may be identical or different, and i and j independently one another are integers of 1 to 4, or a compound obtained by previously reacting (A) the above epoxy resin, (B) the above halogen-containing bisphenol compound and (C) a glycidyl etherification product of a halogen-containing bisphenol compound which is represented by the following formula (2): Image (2) wherein R2 represents a hydrogen atom or a methyl group and the two R2 may be identical or different, Y and Y' represent halogen atom and may be identical or different, n represents an average recurring unit number and is 0 to 10 and k and 1 independently one another are integers of 1 to 4, and (2) an epoxy hardener.
Endo Yasuhiro
Hayashi Toshiaki
Kamio Kunimasa
Kitayama Shinichiro
Shibata Mitsuhiro
Bull Housser & Tupper Llp
Sumitomo Chemical Co. Ltd.
LandOfFree
Epoxy resin composition and copper-clad laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Epoxy resin composition and copper-clad laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition and copper-clad laminate will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1753836