C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4602, 400/58
C08L 77/00 (2006.01) C08G 59/22 (2006.01) C08L 63/00 (2006.01) C08L 63/02 (2006.01) C09J 163/00 (2006.01) C09J 163/02 (2006.01) C09J 177/00 (2006.01)
Patent
CA 2009205
EPOXY RESIN COMPOSITION AND METHOD OF BONDING ARTICLES USING SAME Abstract of the Disclosure: An epoxy resin composition is disclosed which comprises a liquid epoxy resin, a curing agent capable of reacting with the epoxy resin when heated to a curing temperature, and a polyamide powder having an average particle size of 150 µm or less and a melting point of at least 170 °C and used in an amount of 1-50 parts by weight per 100 parts by weight of the epoxy resin.
Akutagawa Ichiro
Matsuzaki Kunimitsu
Yamaguchi Tutomu
Sim & Mcburney
Somar Corporation
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