Epoxy resin composition and multilayer printed wiring board...

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

356/17, 400/7921

C08K 3/34 (2006.01) C08G 59/24 (2006.01) C08G 59/50 (2006.01) C08K 3/36 (2006.01) H05K 1/03 (2006.01) H05K 1/14 (2006.01)

Patent

CA 2014580

EPOXY RESIN COMPOSITION AND MULTILAYER PRINTED WIRING BOARD HAVING INSULATING LAYER FORMED THEREFROM Abstract of the Disclosure: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 µm or less, and silica having an average particle size of 20 µm or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80 % based on the total weight of the silica and the mica.

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