C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) C08G 59/32 (2006.01) C08G 59/38 (2006.01) C08G 59/62 (2006.01) C08L 63/02 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2265216
An epoxy resin composition comprising (A) a bifunctional crystalline epoxy compound, (B) an amorphous trisphenolmethane type epoxy compound having three or more of epoxy groups in a molecule, and (C) an epoxy curing agent having phenolic hydroxyl groups. The resin composition has an excellent moldability (low viscosity and can be filled with filler with high density) and high softening point, and is used preferably as an encapsulating material for electronic device.
Hirano Yasuhiro
Matsuoka Yoshiki
Nakajima Nobuyuki
Fetherstonhaugh & Co.
Sumitomo Chemical Co. Ltd.
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