Epoxy resin composition and resin-encapsulated semiconductor...

C - Chemistry – Metallurgy – 08 – L

Patent

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C08L 63/00 (2006.01) C08K 5/13 (2006.01) C08L 61/06 (2006.01) C08L 61/12 (2006.01) H01B 3/40 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2094344

ABSTRACT OF THE DISCLOSURE An epoxy resin composition having a lower hygroscopicity and a good balance between the heat- resistance, curability and adhesiveness and a resin- encapsulated semiconductor device produced by using the same composition, which epoxy resin composition comprises an epoxy resin having at least two epoxy groups in a molecule and a polyhydric phenol represented by the following general formula: Image

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