C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) C08K 5/13 (2006.01) C08L 61/06 (2006.01) C08L 61/12 (2006.01) H01B 3/40 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2094344
ABSTRACT OF THE DISCLOSURE An epoxy resin composition having a lower hygroscopicity and a good balance between the heat- resistance, curability and adhesiveness and a resin- encapsulated semiconductor device produced by using the same composition, which epoxy resin composition comprises an epoxy resin having at least two epoxy groups in a molecule and a polyhydric phenol represented by the following general formula: Image
Kamio Kunimasa
Morimoto Takashi
Saito Noriaki
Shiomi Yutaka
Sugiyama Yasuhide
Fetherstonhaugh & Co.
Sumitomo Chemical Co. Ltd.
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