C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/24 (2006.01) C08G 59/22 (2006.01) C08G 59/38 (2006.01) C08G 59/62 (2006.01) C08L 63/00 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2157148
An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) Image Image (1) wherein R1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups or halogen, and X represents Image Image Image Image and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product having low hygroscopic property and high adhesiveness.
Akiba Masatsugu
Morimoto Takashi
Saito Noriaki
Shiomi Yutaka
Takebe Kazuo
Fetherstonhaugh & Co.
Sumitomo Chemical Co. Ltd.
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