C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/36 (2006.01) C08L 63/04 (2006.01) H01L 23/29 (2006.01)
Patent
CA 2174678
Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100°C is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.
Matsumoto Hisashi
Togashi Eiki
Kirby Eades Gale Baker
Mitsui Chemicals Inc.
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