Epoxy resin composition containing poly...

Details Epoxy resin composition containing poly... Epoxy resin composition containing poly...

C - Chemistry, Metallurgy

08

F

154/141, 117/183

C08F 283/10 (2006.01)

Patent

CA 1258720

Abstract of the Disclosure A solventless, fluid epoxy resin composition is storage-stable against separation of phases for at least one year, and when cured provides adhesive bonds of improved peel strength at room and low temperatures without loss of lap shear strength at room and elevated temperatures, The composition comprises an epoxide group-containing compound having in situ polymerized, elastomeric particles colloidally dispersed therein, and as curing agent a poly(oxyhydrocarbolene)diamine compound and optionally, and preferably, a cure accelerator.

459528

Affiliated with

Also associated with

Rating

Epoxy resin composition containing poly... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin composition containing poly..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin composition containing poly... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1221496