C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) C08G 59/40 (2006.01) C08G 59/62 (2006.01) C08K 3/00 (2006.01) C08K 5/5333 (2006.01) H05K 1/03 (2006.01) C08L 61/34 (2006.01)
Patent
CA 2505396
An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxazine resin, and an optional co-curing agent.
La présente invention concerne une composition de résine époxy qui comprend une résine époxy, un agent de durcissement phosphonate réactif, une charge inorganique dont la présence permet de réduire les quantités de phosphonate par comparaison avec une composition dépourvue de ladite charge, une résine polybenzoxazine facultative, et un agent de co-durcissement facultatif.
Buczek Mark
Levchik Sergei
Akzo Nobel N.v.
Mcfadden Fincham
Supresta Llc
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