C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/68 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01)
Patent
CA 2581077
Disclosed is an epoxy resin composition for optical semiconductor encapsulation which contains an epoxy resin obtained by co- hydrolysis/condensation of alkoxy silicon compounds expressed as XSi(R1)n(OR2)3-n (wherein X represents an organic group having an epoxy group; R1 represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted aryl group or a substituted or unsubstituted alkenyl group having 2-5 carbon atoms; R2 represents an alkyl group having 1-4 carbon atoms; n represents an integer of 0-2; and when more than one R1 are included, they may be the same as or different from each other) or co-hydrolysis/condensation of such an alkoxy silicon compound and another specific alkoxy silicon compound.
L~invention concerne une composition de résine époxy pour encapsulation de semi-conducteur optique contenant une résine époxy obtenue par co-hydrolyse/condensation de composés de silicium alcoxy exprimés comme XSi(R1)n(OR2)3-n (où X représente un groupe organique ayant un groupe époxy ; R1 représente un groupe alkyle substitué ou non substitué ayant 1-10 atomes de carbone, un groupe aryle substitué ou non substitué ou un groupe alcényle substitué ou non substitué ayant 2-5 atomes de carbone; R2 représente un groupe alkyle ayant 1-4 atomes de carbone ; n représente un entier de 0-2 ; et si plus d~un R1 est inclus, ils peuvent être identiques ou différents l~un de l~autre) ou co-hydrolyse/condensation d~un tel composé de silicium alcoxy et d~un autre composé spécifique de silicium alcoxy.
Kawada Yoshihiro
Miyagawa Naofusa
Nakayama Koji
Oshimi Katsuhiko
Umeyama Chie
Marks & Clerk
Nippon Kayaku Kabushiki Kaisha
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