Epoxy resin compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/5051

C08L 63/00 (2006.01) G11C 27/00 (2006.01) H01L 27/088 (2006.01) H01L 27/092 (2006.01) H01L 27/105 (2006.01) H01L 29/78 (2006.01) H03K 3/353 (2006.01) H03K 17/60 (2006.01) H03K 17/693 (2006.01)

Patent

CA 1037188

ABSTRACT OF THE DISCLOSURE The present invention relates to the improvement of epoxy resins which have previously been modified by butadiene-acrylonitrile/methacrylonitrile copolymers, by vulcanizing the modifying copolymer with an organic peroxide or sulfur, particularly dicumyl peroxide, in an amount by weight of the copolymer of from 1.5 to 10%, to produce a modified epoxy resin being useful and having properties as a high temperature structural adhesive as well as in coatings and laminates.

193539

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