C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/252, 402/261
C08G 59/42 (2006.01) C08L 63/00 (2006.01) C09D 3/58 (1980.01)
Patent
CA 1117697
Abstract Disclosed are epoxy resin compositions comprising at least one polyglycidyl derivative of an aminophenol having the structure Image and at least one biphenyl anhydride having the structure Image wherein m is 1 or 2; wherein A is selected from the group consisting of Image and Image , wherein each R° is individually a monovalent radical selected from the group consisting of hydrogen, halogen, hydroxy, alkyl radical having from 1 to 5 carbon atoms, alkoxy radical having from 1 to 5 carbon atoms and Image , wherein R1 is an alkyl radical having from 1 to 5 carbon atoms; and wherein each R2 is individually a monovalent radical selected from the group consisting of hydrogen, halogen, alkyl radical having from 1 to 5 carbon atoms, -N02, -COOH -S03H, and -NH2. The compositions are useful in such applications as molding resins, laminates, adhesives, coatings and the like. The disclosed epoxy resin-anhydride systens can be cured at ambient temperatures to afford products having useful pro- perties at high temperature.
269080
Gowling Lafleur Henderson Llp
Lord Corporation
LandOfFree
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