Epoxy resin compositions and resin-encapsulated...

C - Chemistry – Metallurgy – 08 – G

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C08G 59/30 (2006.01) C07D 303/22 (2006.01) C08G 59/62 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2102653

ABSTRACT EPOXY RESIN COMPOSITIONS AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICES An epoxy resin composition which can provide cured products high in adhesion and crack resistance in soldering with high heat resistance and low moisture absorption and a semiconductor devices encapsulated with said composition are disclosed. The above epoxy resin composition comprises as essential components an epoxy resin represented by the following formula (1): Image (1) wherein R1 represents a halogen atom, an alkyl or cycloalkyl group of 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom and when two or more R1 are present in the same or different rings, they may be the same or different and m represents an integer of 0 to 4, and a polyhydric phenol as a curing agent.

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