C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/7917
C08L 63/00 (2006.01) C08G 59/24 (2006.01) C08G 59/62 (2006.01) C08G 59/68 (2006.01)
Patent
CA 2036414
T 1197 A B S T R A C T EPOXY RESIN COMPOSITIONS FOR ENCAPSULATING SEMICONDUCTIVE ELEMENTS Epoxy resin compositions for encapsulating semiconductive elements showing when cured a high glass transition temperature, an excellent crack resistance under soldering and a low chlorine ion generation rate upon curing comprising (a) epoxy resin (b) phenolic curing agent (c) tris(dialkoxyphenyl) phosphine represented by the general formula (I): Image (I) wherein R1 and R2 each may represent a C1-4 alkyl group and (d) inorganic filler. C10/T1197FF
Konishi Isako
Kurio Takuya
Murata Yasukuki
Nakanishi Yoshinoi
Shell Internationale Research Maatschappij B.v.
Swabey Ogilvy Renault
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