C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/04 (2006.01) C08G 59/50 (2006.01) C08G 59/62 (2006.01)
Patent
CA 2365480
A composition comprising (a) an epoxy resin having, on average, more than one 1,2-epoxy group per molecule, (b) a polyol as epoxy resin curing agent and (c) a solid microgel-amine adduct as accelerator has high latency, good storage stability and a wide processing window.
Cette invention concerne une composition contenant: (a) une résine époxy comprenant en moyenne plus d'un groupe 1,2-époxy par molécule; (b) un polyol en tant qu'agent de durcissement de résine époxy; un produit d'addition amine microgel solide en tant qu'activateur. Ladite composition présente une latence élevée, une bonne stabilité au stockage et une large fenêtre de traitement.
Reitmajer Gunnar
Roth Martin
Spitzer Martin
Tang Qian
Willis Philip David
Fetherstonhaugh & Co.
Huntsman Advanced Materials (switzerland) Gmbh
Vantico Ag
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