Epoxy resin compositions, prepregs, cured composites, and...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 63/00 (2006.01) C08G 59/18 (2006.01) C08G 59/50 (2006.01) C08J 3/20 (2006.01) C08J 5/24 (2006.01)

Patent

CA 2230872

Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.

Cette invention concerne des compositions de résine époxy solidifiables, ne contenant de préférence aucun solvant, et dans lesquelles un agent de solidification à base d'amine de fluorène est partiellement dissous par fusion et partiellement dispersé en qualité de solide dans au moins un polyépoxide aromatique. Ces compositions permettent d'obtenir des préimprégnés offrant une bonne adhérence en même temps que des qualités de conservation étonnantes. Cette invention concerne également des composites solidifiés comprenant ces préimprégnés. Les composites solidifiés présentent une faible migration de résine et possèdent des températures de transition du verre qui sont comparables à celles de résines pures solidifiées.

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