Epoxy resin curatives and method

Details Epoxy resin curatives and method Epoxy resin curatives and method

C - Chemistry, Metallurgy

08

G

C08G 59/40 (2006.01) C08G 59/50 (2006.01)

Patent

CA 2065611

ABSTRACT OF THE DISCLOSURE (D#81,039-F) An epoxy resin composition comprises the cured reaction product of an epoxy resin and a lactone-imidazole complex. For example, complexes of butyrolactone and caprolactone with 1-isopropyl-2-methyl imidazole were formed wherein the mole ratio of lactone:imidazole ranged from 1:1 to 2:1. The complexes are less reactive than the imidazole alone, giving them an extended pot life. The compositions are useful for making filament windings where an extended working time is required. Other applications include those in which it would be impractical to use the more reactive unmodified imidazole as the sole curing agent. 81039.APP2

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