C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/24 (2006.01) C08J 5/24 (2006.01) C08L 63/02 (2006.01) H01L 23/14 (2006.01)
Patent
CA 2578687
Disclosed is an epoxy resin which is a compound obtained by reacting 4,4'- bisphenol F with epichlorohydrin and represented by the formula (1) below. In this epoxy resin, the ratio of dinuclear component determined by GPC is not more than 25% by area. (1)
La présente invention décrit une résine époxy qui représente un composé obtenu en faisant réagir du 4,4~-bisphénol F avec de l~épichlorohydrine et représenté par la formule (1) ci-dessous. Dans la résine époxy, le rapport du composé dinucléaire par CPG ne représente pas plus de 25 % en surface. (1)
Akatsuka Yasumasa
Nakanishi Masataka
Oshimi Katsuhiko
Nippon Kayaku Kabushiki Kaisha
Ridout & Maybee Llp
LandOfFree
Epoxy resin, epoxy resin composition, and cured product thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Epoxy resin, epoxy resin composition, and cured product thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin, epoxy resin composition, and cured product thereof will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1718453