C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/14 (2006.01) C08G 59/40 (2006.01) C08G 59/50 (2006.01) C08J 5/24 (2006.01) C08L 63/00 (2006.01) C09K 21/14 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2158367
Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: --a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, and --an aromatic polyamine as the hardener. -21-
Huber Jurgen
Kapitza Heinrich
Kleiner Hans-Jerg
Rogler Wolfgang
von Gentzkow Wolfgang
Aktiengesellschaft Siemens
Fetherstonhaugh & Co.
Hoechst Aktiengesellschaft
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