Epoxy resin mixtures

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 59/50 (2006.01) C08G 59/14 (2006.01) C08G 59/30 (2006.01) C08G 59/32 (2006.01) H01B 3/40 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2158362

Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: --a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) at least one compound from the group consisting of phosphinic acid, phosphonic acids, pyrophosphonic acids and phosphonic acid monoesters, and --an aromatic polyamine as the hardener. -21-

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