Epoxy resin-modified polysiloxane film compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/4107, 400/53

C08L 83/06 (2006.01) C08G 59/16 (2006.01) C08L 63/10 (2006.01) C09D 163/00 (2006.01) C09D 183/04 (2006.01)

Patent

CA 1175987

Abstract What is disclosed herein is a room temperature curable, one component epoxy resin modified silicone resin which has excellent heat resistance, adhesiveness to substrates, and is hard. The composition, when cured, provides excellent heat resistance to temperatures of 400 to 600°C. and also provides hard films which stick tenaciously to various substrates even when cured at room temperature.

383295

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