Epoxy resin moulding compositions

Details Epoxy resin moulding compositions Epoxy resin moulding compositions

C - Chemistry, Metallurgy

08

L

400/5460, 400/79

C08L 63/00 (2006.01) C08G 59/10 (2006.01) C08G 59/18 (2006.01) C08G 59/28 (2006.01) C08G 59/62 (2006.01) C08L 63/02 (2006.01)

Patent

CA 1131827

3-12093/+ Epoxy resin moulding compositions Abstract of the Disclosure A moulding composition consisting of an epoxy resin adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine together with a filler, an accelerator, and an aromatic polyol as hardener. Mouldings having excellent resistance to cracking can be obtained from this moulding composition.

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