C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4019, 400/51
C08L 63/02 (2006.01) C08G 59/18 (2006.01) C08G 59/22 (2006.01) C08K 3/34 (2006.01) C08K 3/36 (2006.01) C08K 7/14 (2006.01) C09D 163/00 (2006.01) C09D 163/02 (2006.01)
Patent
CA 1326096
ABSTRACT OF THE DISCLOSURE An epoxy resin powder coating composition with excellent adhesibility which comprises a bisphenol A type mixed epoxy resin having a number average molecular weight of from 800 to 2,000 comprising a mixture of a bisphenol A type epoxy resin having a number average molecular weight of from 350 to 1,000 and a bisphenol A type epoxy resin having a number average molecular weight of from 2,500 to 8,000, an imidazole compound, dicyandiamide, a pre-reacted product of an imidazole compound with epoxy resin, and a filler, wherein the amount of said imidazole compound is 0.1 to 3 parts by weight per 100 parts by weight of the mixed epoxy resin, the amount of said dicyanmide is 1 to 10 parts by weight per 100 parts by weight of the mixed epoxy resin, and the amount of said pre-reacted product is 0.2 to 3 parts by weight per 100 parts by weight of the mixed epoxy resin.
574355
Kitagawa Katugi
Shinozuka Akira
Riches Mckenzie & Herbert Llp
Somar Corporation
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