Epoxy resins based on diaminobisimide compounds

Details Epoxy resins based on diaminobisimide compounds Epoxy resins based on diaminobisimide compounds

C - Chemistry, Metallurgy

07

D

C07D 487/04 (2006.01) C07D 209/48 (2006.01) C07D 401/14 (2006.01) C07D 403/14 (2006.01) C07D 405/14 (2006.01) C08G 59/40 (2006.01) C08J 5/24 (2006.01) C08K 5/3417 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2093322

A method for the preparation of a diaminobisimide compound of formula (I) substantially free of oligomers, wherein Ar1 is an optionally substituted aromatic residue which provides for good conjugation between the nitrogen containing groups; and Ar is an optionally substituted aromatic residue characterized in that at least two molar proportions of an aromatic dia- mine of the formula (II): H2N-Ar1=NH2 wherein Ar1 is as defined above, are heated with one molar proportion of an aro- matic tetracarboxylic acid of the formula (III): (HOOC)2Ar(COOOH)2, or the corresponding dianhydride, wherein Ar is as defined above, optionally in the presence of a polar solvent and optionally including 0.1 to 2 molar proportions of a tertiary amine. The compounds of formula (I) are useful curing agents in epoxy resin formulations.

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