Epoxy type spherical particulate adhesive and process for...

Details Epoxy type spherical particulate adhesive and process for... Epoxy type spherical particulate adhesive and process for...

C - Chemistry, Metallurgy

09

J

400/7902

C09J 163/00 (2006.01) C08G 59/18 (2006.01) C08J 3/16 (2006.01) G02F 1/1339 (2006.01)

Patent

CA 1287427

EPOXY TYPE SPHERICAL PARTICULATE ADHESIVE AND PROCESS FOR PREPARATION THEREOF ABSTRACT OF THE DISCLOSURE A spherical particulate adhesive comprising at least an epoxy resin as the main component and having an average particle size of 0.3 to 500 µm, in which particles of the epoxy resin contain a latent curing agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic materials, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.

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